Iprofayile yekhampani
Yasekwa ngo-2003, iXinfucheng Electronics Co., Ltd.ibekwe eShenzhen, xa kucingwa ukuba ishishini lobuchwepheshe be-elektroniki liyakhula.Yiprobe yobuchwephesha kunye nomenzi wesokethi yovavanyo.Umzi-mveliso wonke ugubungela indawo2,000 square metres.Umgca wokuhlanganisa, i-CNC lathe, i-electroplating assembly line, kunye nezixhobo zokuvavanya ezisebenzayo.Sinamandla kunye nezisombululo zeengxaki ezinzima zobugcisa, ii-odolo ezahlukeneyo, ukuthunyelwa ngokukhawuleza, umgangatho ozinzile.Yenzelwe kwaye yenziwe ngaphezulu kwamashumi amawaka eemveliso kwiimfuno kunye neemfuno zabathengi.I-Xinfucheng iyaqhubeka nokuzisa itekhnoloji yokuvelisa iprobe kunye nokwahluka .Iimveliso zeprobe ziphuhliswe ngophando oluqhubekayo kunye nophuhliso, impumelelo, kugxininise ekusetyenzisweni ngokubanzi kuvavanyo lweemveliso ezikumgangatho ophezulu ezifana neshishini le-semiconductor, ishishini le-elektroniki, kunye neshishini lePCB.Umgangatho uthelekiseka nowaseYurophu, e-US, eJapan kunye namanye amazwe afumene isiqinisekiso kunye nentembeko kumzi mveliso weprobe kunye neenduser.
Indlela yoPhuhliso
Ngomhla wesi-3 ku-Agasti ka-2003, uMboniso we-Electronics we-Shenzhen Xinfucheng kunye neSebe lezeNtengiso lasekwa ngokusesikweni.Ekuqaleni kokusekwa, eyona ntengiso kunye nokuhanjiswa kweemvavanyo zaziseKorea, eJapan, eJamani nase-United States.
Isebe lentengiso ye-Xinfucheng Electronics yaqala ukuthengisa iiprobes / ii-scokets zokuvavanya ngobuninzi kuMazantsi e-China naseMpuma ye-China, kwaye ixabiso lemveliso yenkampani ligqithise kwi-5 yezigidi ze-yuan okokuqala.
I-Xinfucheng Electronics Exhibition and Sales Department yaseka umgca wendibano kwaye yaqalisa ukuthenga iinxalenye zeprobe zangaphandle ngobuninzi bendibano kunye neentengiso ze-OEM.
Kwi-2016, uyilo kunye nokuveliswa kweesokethi zokuvavanya kwaqala.Inomgca wemveliso we-CNC, isebe lonyango lobushushu, umgca wokuvelisa i-electroplating, umgca wendibano ... & ukwazisa imowudi yokulawula ukusebenza kakuhle.
Ngo-2017, iNkampani yeXinfucheng yabeka phambili imigaqo-nkqubo emine emikhulu.Inkampani yeXinfucheng yaqulunqa "iSicwangciso soPhuhliso se-2017 ~ 2019".
Umda woShishino
◎Iphini yovavanyo lwephakheji yeSemiconductor (i-BGA Testing Probes)
◎ Isokethi yovavanyo lweSemiconductor (Isokethi yoVavanyo ye-BGA)
◎ Uvavanyo lwebhodi yesekethe eprintiweyo yePCB (IiProbe zeSiko)
◎ UVavanyo lweSekethe engaphakathi. kunye noMsebenzi (IiProbe zoVavanyo)
◎ Inaliti yeCoaxial high frequency (Coaxial Probes)
◎ Inaliti ye-coaxial ephezulu yangoku (iiProbe zoVavanyo oluPhezulu lwangoku)
◎ Ibhetri & nePin yeAntenna
Ishishini leNkonzo
PCB
ICPU
i-ram
Ikhadi leMizobo
CMOS
ICT (Uvavanyo lwe-Intanethi)
Iindibano zeSocket zovavanyo
Iikhamera
Iselula
INKXABO ELUMILEYO
Indlela ye-IC
Uvavanyo oludityanisiweyo lwesekethe ikakhulu lubandakanya ukuqinisekiswa koyilo kuyilo lwetshiphu, uhlolo lwewafer kwimveliso ye-wafer, kunye novavanyo lwemveliso egqityiweyo emva kokupakishwa.Kungakhathaliseki ukuba yiyiphi isiteji, ukuvavanya izibonakaliso ezahlukeneyo zokusebenza ze-chip, amanyathelo amabini kufuneka agqitywe.Enye kukudibanisa izikhonkwane ze-chip kunye nemodyuli esebenzayo yomvavanyi, kwaye enye kukusebenzisa iimpawu zegalelo kwi-chip ngokusebenzisa umhloli, kwaye ukhangele ukusebenza kwe-chip.Iimpawu zeziphumo zokugweba ukusebenza kwemisebenzi yetshiphu kunye nezalathi zokusebenza.
Ubume boMbutho
